AF200-303005

Mfr.Part #
AF200-303005
Manufacturer
CUI Devices
Package/Case
-
Datasheet
Download
Description
Thermal Interface Products Thermal Pad, Non-Silicone Elastomer, 2.0 W/m*K Thermal Conductivity

Request A Quote(RFQ)

* Contact Name:
* Company:
* E-Mail:
* Phone:
* Comment:
* Captcha:
loading...
Manufacturer :
CUI Devices
Product Category :
Thermal Interface Products
Breakdown Voltage :
2.5 kVAC
Color :
White
Length :
30 mm
Material :
Non-Silicone Elastomer
Maximum Operating Temperature :
+ 125 C
Minimum Operating Temperature :
- 45 C
Product :
Thermally Conductive Gap Pad
Series :
AF200
Tensile Strength :
30 psi
Thermal Conductivity :
2 W/m-K
Thickness :
0.5 mm
Width :
30 mm
Datasheets
AF200-303005

Manufacturer related products

  • CUI Devices
    Modular Connectors / Ethernet Connectors 10/100/1000 BaseT, 8P10C, Single Port, Horizontal, Shielded, LED, Through Hole, RJ45 with Integrated Magnetics Modular Connector
  • CUI Devices
    Modular Connectors / Ethernet Connectors 10/100/1000 BaseT, 8P10C, Single Port, Horizontal, Shielded, LED, Through Hole, RJ45 with Integrated Magnetics Modular Connector
  • CUI Devices
    Modular Connectors / Ethernet Connectors 8P8C, Single Port, Vertical, Shielded, No LED, Through Hole, RJ45 Modular Connector
  • CUI Devices
    Modular Connectors / Ethernet Connectors 8P8C, Single Port, Vertical, Shielded, LED, Through Hole, RJ45 Modular Connector
  • CUI Devices
    Modular Connectors / Ethernet Connectors 8P8C, Single Port, Vertical, Unshielded, LED, Through Hole, RJ45 Modular Connector

Catalog related products

  • Laird Performance Materials
    Thermal Interface Products COOLZORB-ULTRA,040 18x18IN,
  • Laird Performance Materials
    Thermal Interface Products COOLZORB-ULTRA,080 18x18IN,
  • Laird Performance Materials
    Thermal Interface Products 27X56MM IRR TFLEX HR440
  • Laird Performance Materials
    Thermal Interface Products 4.00 127x76mm
  • Laird Performance Materials
    Thermal Interface Products COOLZORB-ULTRA,080 4x4IN,

Related products

Part Manufacturer Stock Description
AF20-Q4A Quectel 0 WiFi Modules - 802.11 Wifi Modules
AF200-101005 CUI Devices 0 Thermal Interface Products Thermal Pad, Non-Silicone Elastomer, 2.0 W/m*K Thermal Conductivity
AF200-151505 CUI Devices 0 Thermal Interface Products Thermal Pad, Non-Silicone Elastomer, 2.0 W/m*K Thermal Conductivity
AF200-153005 CUI Devices 0 Thermal Interface Products Thermal Pad, Non-Silicone Elastomer, 2.0 W/m*K Thermal Conductivity
AF200-202005 CUI Devices 0 Thermal Interface Products Thermal Pad, Non-Silicone Elastomer, 2.0 W/m*K Thermal Conductivity
AF200-204005 CUI Devices 0 Thermal Interface Products Thermal Pad, Non-Silicone Elastomer, 2.0 W/m*K Thermal Conductivity
AF200-265005 CUI Devices 0 Thermal Interface Products Thermal Pad, Non-Silicone Elastomer, 2.0 W/m*K Thermal Conductivity
AF200-301205 CUI Devices 0 Thermal Interface Products Thermal Pad, Non-Silicone Elastomer, 2.0 W/m*K Thermal Conductivity
AF200-313005 CUI Devices 0 Thermal Interface Products Thermal Pad, Non-Silicone Elastomer, 2.0 W/m*K Thermal Conductivity
AF200-404005 CUI Devices 0 Thermal Interface Products Thermal Pad, Non-Silicone Elastomer, 2.0 W/m*K Thermal Conductivity
AF200-414505 CUI Devices 0 Thermal Interface Products Thermal Pad, Non-Silicone Elastomer, 2.0 W/m*K Thermal Conductivity
AF200-505005 CUI Devices 0 Thermal Interface Products Thermal Pad, Non-Silicone Elastomer, 2.0 W/m*K Thermal Conductivity
AF200-707005 CUI Devices 1 Thermal Interface Products Thermal Pad, Non-Silicone Elastomer, 2.0 W/m*K Thermal Conductivity
AF2010FK-0710RL YAGEO 0 Thick Film Resistors - SMD 10Ohms 3/4W 2010 1% AEC-Q200
AF2010FK-0710RL YAGEO 0 Thick Film Resistors - SMD 10Ohms 3/4W 2010 1% AEC-Q200